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12 story high TG thick copper plate
Purpose: template power supply Layer: 12-layer Material: FR-4 Hi-Tg170 Plate thickness: 3.0mm Minimum line width/spacing: 12/12mil Copper Thickness: 3oz Hole copper: 25um
Classification:
Power module board
Product accessories:
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Product Description
Equipped with complete equipment, it has its own multilayer board pressing, surface treatment tin spraying line and other equipment, with an annual design production capacity of 10-180000 square meters. The products are mainly used in high-tech fields such as computers, communication equipment, industrial control, instrumentation and automobile control systems. Has obtained the United States UL,RoHS,ISO certification, product quality all the implementation of the United States IPC-A-600 standards. In terms of service, the company has established a complete set of tracking service mechanism for customers. A rapid response mechanism for orders has been established. Emergency orders are clearly marked, placed in different areas and followed up by special personnel to ensure that orders are always under effective control from receipt to shipment and to ensure punctual delivery.
Purpose: template power supply
Layer: 12-layer
Material: FR-4 Hi-Tg170
Plate thickness: 3.0mm
Minimum line width/spacing: 12/12mil
Copper Thickness: 3oz
Hole copper: 25um
template power supply
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